Solutions Provider Seeks “Innovation Partners” at Medical Summit
In a move that underscores the growing trend toward early-stage collaboration between medical manufacturers and their component suppliers, Bal Seal Engineering, Inc. has announced that it will participate in the Cleveland Clinic’s Medical Innovations Summit, to be held November 10th-12th, 2008 in Cleveland, Ohio.
Foothill Ranch, CA, November 09, 2008 --(PR.com)-- Bal Seal, a California-based company with a 20-year history of supplying worldwide medical device and electronics manufacturers with connecting and sealing solutions, says the purpose of its participation in the summit is to identify and engage “innovation partners.” By collaborating with these partners at the beginning of the product development cycle, the company aims to streamline the advancement and introduction of new medical technology.
“We see this event as crossroads of opportunity,” says Bal Seal Marketing Director Bill Nissim of his company’s decision to attend the summit and display a selection of products. “In the medical industry, there’s an increasing demand for innovation at every level of the supply chain. Important advances aren’t being driven solely by the manufacturer anymore -- they’re a cooperative effort involving component suppliers who have the resources and experience to actually make the OEM’s product better.”
Nissim points to his company’s Bal Conn™ product as an example of a solution born of just such an “innovation partnership.” The electrical connector, which consists of a tiny, precisely-engineered canted-coil™ spring retained in a metal housing, was originally developed in cooperation with a neurostimulation device manufacturer seeking to reduce package size while improving reliability. Today, the Bal Conn ensures reliable connection between the lead and battery in more than one million implantable devices worldwide, including those used in pain management, cardiac healthcare and sensing therapies.
Medical Innovation Summit attendees can learn more about the Bal Conn and other connecting, sealing, conducting and shielding solutions by visiting Bal Seal Engineering’s tabletop exhibit, or by visiting the company’s Website at http://mediaroom.balseal.com.
About Bal Seal Engineering, Inc.
Bal Seal Engineering, Inc. is a global provider of custom-engineered connecting, sealing, conducting, and shielding solutions for medical device and medical electronics OEMs. Products include Bal Conn™, Bal Seal™, and Bal Shield™ solutions, all of which employ unique canted-coil™ spring technology for enhanced performance and reliability. For the latest news and information about Bal Seal, visit http://mediaroom.balseal.com or call 800.366.1006.
About the Cleveland Clinic Medical Innovation Summit
Held November 10th-12th, 2008 at the InterContinental Hotel & Bank of America Conference Center in Cleveland, Ohio, this two-day conference brings more than 1000 senior medical executives, investors, entrepreneurs and clinicians together for the purpose of discussing new medical innovations and the financial drivers behind them. It features speakers, panel discussions and clinical presentations, as well as exhibits from 12:00 p.m. to 6:30 p.m. on the 10th, 7:00 a.m. to 7:00 p.m. on the 11th, and 7:00 a.m. to 2:00 p.m. on the 12th. For more information, visit http://www.clevelandclinic.org/innovations/summit/.
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“We see this event as crossroads of opportunity,” says Bal Seal Marketing Director Bill Nissim of his company’s decision to attend the summit and display a selection of products. “In the medical industry, there’s an increasing demand for innovation at every level of the supply chain. Important advances aren’t being driven solely by the manufacturer anymore -- they’re a cooperative effort involving component suppliers who have the resources and experience to actually make the OEM’s product better.”
Nissim points to his company’s Bal Conn™ product as an example of a solution born of just such an “innovation partnership.” The electrical connector, which consists of a tiny, precisely-engineered canted-coil™ spring retained in a metal housing, was originally developed in cooperation with a neurostimulation device manufacturer seeking to reduce package size while improving reliability. Today, the Bal Conn ensures reliable connection between the lead and battery in more than one million implantable devices worldwide, including those used in pain management, cardiac healthcare and sensing therapies.
Medical Innovation Summit attendees can learn more about the Bal Conn and other connecting, sealing, conducting and shielding solutions by visiting Bal Seal Engineering’s tabletop exhibit, or by visiting the company’s Website at http://mediaroom.balseal.com.
About Bal Seal Engineering, Inc.
Bal Seal Engineering, Inc. is a global provider of custom-engineered connecting, sealing, conducting, and shielding solutions for medical device and medical electronics OEMs. Products include Bal Conn™, Bal Seal™, and Bal Shield™ solutions, all of which employ unique canted-coil™ spring technology for enhanced performance and reliability. For the latest news and information about Bal Seal, visit http://mediaroom.balseal.com or call 800.366.1006.
About the Cleveland Clinic Medical Innovation Summit
Held November 10th-12th, 2008 at the InterContinental Hotel & Bank of America Conference Center in Cleveland, Ohio, this two-day conference brings more than 1000 senior medical executives, investors, entrepreneurs and clinicians together for the purpose of discussing new medical innovations and the financial drivers behind them. It features speakers, panel discussions and clinical presentations, as well as exhibits from 12:00 p.m. to 6:30 p.m. on the 10th, 7:00 a.m. to 7:00 p.m. on the 11th, and 7:00 a.m. to 2:00 p.m. on the 12th. For more information, visit http://www.clevelandclinic.org/innovations/summit/.
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Contact
Bal Seal Engineering, Inc.
Alicia Parker
949-460-2262
www.balseal.com
Alicia Parker
949-460-2262
www.balseal.com
Contact
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