Solutions Provider to Seek “Innovation Partners” at Medica Trade Fair
In a move that underscores the growing trend toward early-stage collaboration between medical manufacturers and their component suppliers, Bal Seal Engineering, Inc. has announced that it will participate in the MEDICA trade fair, held November 19th-22nd, 2008 in Düsseldorf, Germany.
Foothill Ranch, CA, November 21, 2008 --(PR.com)-- Bal Seal, a U.S.-based firm with a 20-year history of supplying worldwide medical device and electronics manufacturers with connecting and sealing solutions, says the purpose of its participation in the fair is to identify and engage “innovation partners.” By collaborating with these partners at the beginning of the product development cycle, the company aims to streamline the advancement and introduction of new medical technology.
“We see this event as crossroads of opportunity,” says Bal Seal Marketing Director Bill Nissim of his company’s decision to attend the fair and display a selection of products. “In the medical industry, there’s an increasing demand for innovation across the supply chain. Important advances aren’t being driven solely by the manufacturer anymore –- they’re a cooperative effort involving component suppliers who have the resources and experience to work with top management on critical design issues that actually make the OEM’s product better.”
Nissim points to his company’s Bal Conn™ product as an example of a solution born of just such an “innovation partnership.” The electrical connector, which consists of a tiny, precisely-engineered canted-coil™ spring retained in a metal housing, was originally developed in cooperation with a neurostimulation device manufacturer seeking to reduce package size while improving reliability. Today, the Bal Conn ensures reliable connection between the lead and battery in more than one million implantable devices worldwide, including those used in pain management, cardiac healthcare and sensing therapies.
MEDICA attendees can learn more about the Bal Conn electrical connector and other connecting, sealing, conducting and shielding solutions by visiting Bal Seal Engineering’s exhibit at space L27 in Hall 8b, or by visiting the company’s Website.
About Bal Seal Engineering, Inc.
Bal Seal Engineering, Inc. is a global provider of custom-engineered connecting, sealing, conducting, and shielding solutions for medical device and medical electronics OEMs. Its products include Bal Conn™, Bal Seal™, and Bal Shield™ solutions, all of which employ unique canted-coil™ spring technology for enhanced performance and reliability. For the latest news and information about Bal Seal, visit their website or call 800.366.1006.
About the MEDICA Trade Fair
MEDICA 2008 will be held November 19th-22nd, 2008 at the Düsseldorf Trade Fair Centre, Messeplatz. Now in its 40th year, this fair is billed as the “world forum for medicine,” and it attracts a broad range of medical professionals, including doctors, nurses, hospital and laboratory managers, physiotherapists and technical medical personnel. The fair’s visitor hours are Wednesday through Friday, 8:30 a.m.-7:30 p.m., and Saturday 10:00 a.m.-5:00 p.m. The COMPAMED fair, which highlights “high tech solutions for medical technology,” runs in parallel with MEDICA from Wednesday through Friday at the same location.
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“We see this event as crossroads of opportunity,” says Bal Seal Marketing Director Bill Nissim of his company’s decision to attend the fair and display a selection of products. “In the medical industry, there’s an increasing demand for innovation across the supply chain. Important advances aren’t being driven solely by the manufacturer anymore –- they’re a cooperative effort involving component suppliers who have the resources and experience to work with top management on critical design issues that actually make the OEM’s product better.”
Nissim points to his company’s Bal Conn™ product as an example of a solution born of just such an “innovation partnership.” The electrical connector, which consists of a tiny, precisely-engineered canted-coil™ spring retained in a metal housing, was originally developed in cooperation with a neurostimulation device manufacturer seeking to reduce package size while improving reliability. Today, the Bal Conn ensures reliable connection between the lead and battery in more than one million implantable devices worldwide, including those used in pain management, cardiac healthcare and sensing therapies.
MEDICA attendees can learn more about the Bal Conn electrical connector and other connecting, sealing, conducting and shielding solutions by visiting Bal Seal Engineering’s exhibit at space L27 in Hall 8b, or by visiting the company’s Website.
About Bal Seal Engineering, Inc.
Bal Seal Engineering, Inc. is a global provider of custom-engineered connecting, sealing, conducting, and shielding solutions for medical device and medical electronics OEMs. Its products include Bal Conn™, Bal Seal™, and Bal Shield™ solutions, all of which employ unique canted-coil™ spring technology for enhanced performance and reliability. For the latest news and information about Bal Seal, visit their website or call 800.366.1006.
About the MEDICA Trade Fair
MEDICA 2008 will be held November 19th-22nd, 2008 at the Düsseldorf Trade Fair Centre, Messeplatz. Now in its 40th year, this fair is billed as the “world forum for medicine,” and it attracts a broad range of medical professionals, including doctors, nurses, hospital and laboratory managers, physiotherapists and technical medical personnel. The fair’s visitor hours are Wednesday through Friday, 8:30 a.m.-7:30 p.m., and Saturday 10:00 a.m.-5:00 p.m. The COMPAMED fair, which highlights “high tech solutions for medical technology,” runs in parallel with MEDICA from Wednesday through Friday at the same location.
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Contact
Bal Seal Engineering, Inc.
Alicia Parker
949-460-2262
www.balseal.com
Alicia Parker
949-460-2262
www.balseal.com
Contact
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