World Advanced Electronic Packaging Revenues Are Poised to Exceed $42 Billion by 2012
With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects.
Montreal, Canada, November 23, 2008 --(PR.com)-- Electronics.ca Publications, the electronics industry market research and knowledge network, announces the availability of a new report entitled "Advanced Electronic Packaging: A Global Strategic Business Report."
With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.
Advanced electronic packaging market is driven mainly by developments in the semiconductor industry. Of late, packages are evolving from simple traditional types to highly advanced and customized solutions. Growth in the market is also attributed to steady penetration into traditional packaging-applications markets. These advanced packages support IC makers' high-performance applications and original equipment manufacturer's (OEM) size-constrained products, as traditional electronic packages fail to meet component requirements. Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable Interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.
Worldwide Advanced Electronic Packaging revenues totaled an estimated $28.27 billion in 2007 and are projected to exceed $42 billion by the end of the year 2012. Asia-Pacific represents the largest regional market with revenues estimated to total $12.2 billion in 2008. Chip Scale Packages are projected to post the fastest annual growth rate over the years 2000 through 2010 in terms of revenues, at 18.9%. Germany led the European market for Advanced Electronic Packaging in 2007, with revenues totaling an estimated $1.26 billion. The United Kingdom is poised to emerge as the second largest European market by 2012, with revenues projected to exceed $1.52 billion.
Key market participants analyzed in the report include Amkor Technology Inc., STATS ChipPAC Ltd., ASM Pacific Technology Ltd., NEC Electronics Corporation, Tessera, Inc., and Toshiba America Electronic Components Inc., among others.
The report "Advanced Electronic Packaging: A Global Strategic Business Report" available at Electronics.ca Publications analyzes the global market with hard-to-find data and analytics for key regional markets such as Asia-Pacific, Europe, United States and Japan. The report provides a comprehensive review of market trends and issues, drivers, business profile, players, recent developments, mergers, acquisitions, alliances, product launches and other strategic industry activities. Analytical estimates and projections are presented in terms of annual revenues in US$ over the years 2000 through 2010. Long-term projections are presented for the years 2011 through 2015. Product segments independently analyzed include Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules.
Details of the new report can be found on Electronics.ca Publications' web site: http://www.electronics.ca/reports/semiconductor_manufacturing/electronic_packaging.html
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With the burgeoning demand for portable devices, demand for advanced electronic packaging for accommodating the integrated circuits that support the aforesaid devices is on rise. Decreasing device size demands low cost electronic packages that are capable of rendering high speed, finer pitch, higher pin count and reliable interconnects. Despite the fact that higher pin count increases cost, manufacturers are finding ways to deliver the most cost effective advanced electronic packages to address the needs of the industry.
Advanced electronic packaging market is driven mainly by developments in the semiconductor industry. Of late, packages are evolving from simple traditional types to highly advanced and customized solutions. Growth in the market is also attributed to steady penetration into traditional packaging-applications markets. These advanced packages support IC makers' high-performance applications and original equipment manufacturer's (OEM) size-constrained products, as traditional electronic packages fail to meet component requirements. Advanced Electronic Packaging industry has grown to a position where its technology has outpaced the semiconductor technology, the parent industry it addresses. Increasing silicon complexity and integration has made it mandatory for packaging technology to provide finer lead pitch, higher I/O counts, improved heat dissipation, and rapid, reliable Interconnect. Simultaneously, the industry is also pushing towards decreased printed circuit board area and complexity, which is exerting further pressure on packaging requirements.
Worldwide Advanced Electronic Packaging revenues totaled an estimated $28.27 billion in 2007 and are projected to exceed $42 billion by the end of the year 2012. Asia-Pacific represents the largest regional market with revenues estimated to total $12.2 billion in 2008. Chip Scale Packages are projected to post the fastest annual growth rate over the years 2000 through 2010 in terms of revenues, at 18.9%. Germany led the European market for Advanced Electronic Packaging in 2007, with revenues totaling an estimated $1.26 billion. The United Kingdom is poised to emerge as the second largest European market by 2012, with revenues projected to exceed $1.52 billion.
Key market participants analyzed in the report include Amkor Technology Inc., STATS ChipPAC Ltd., ASM Pacific Technology Ltd., NEC Electronics Corporation, Tessera, Inc., and Toshiba America Electronic Components Inc., among others.
The report "Advanced Electronic Packaging: A Global Strategic Business Report" available at Electronics.ca Publications analyzes the global market with hard-to-find data and analytics for key regional markets such as Asia-Pacific, Europe, United States and Japan. The report provides a comprehensive review of market trends and issues, drivers, business profile, players, recent developments, mergers, acquisitions, alliances, product launches and other strategic industry activities. Analytical estimates and projections are presented in terms of annual revenues in US$ over the years 2000 through 2010. Long-term projections are presented for the years 2011 through 2015. Product segments independently analyzed include Ball Grid Arrays, Chip Scale Packages, and Multi Chip Modules.
Details of the new report can be found on Electronics.ca Publications' web site: http://www.electronics.ca/reports/semiconductor_manufacturing/electronic_packaging.html
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Chiaki Sadanaga
+1 514 429 1520
http://www.electronics.ca
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