Precision Process Equipment Expands Equipment Offering with Excellite 1000 BCP

Niagara Falls, NY, October 30, 2009 --(PR.com)-- Precision Process Equipment Inc, expands their equipment line intended for solar cell, semi conductor and microelectronic packaging manufacturers.

Finding success with the Excellite FSP, designed for wide-web, reel-to-reel (R2R) Flexible substrate plating for manufacturing flexible CIS, CIGS and TCO coatings associated with thin film solar cells, Precision Process now offers the Excellite 1000 BCP intended for use in plating on silicon or glass substrates for discrete parts. The Excellite BCP offers a fully automated dry-in dry-out cassette-to-cassette tool set.

The Excellite 1000 BCP can be configured for pre plate deposition of seed or barrier layers, plating of a variety of metals and post plate annealing if required. The Excellite 1000 will produce superior yields on thin fragile substrates, in both inline deposition systems as well as other automation set-ups common to Si-Cell or glass photovoltaic production systems with maximum through put and high yields.

Precision Process Equipment personnel have been specializing in engineering wet chemical processing systems for 40 years. Precision process offers a full line of wet processing solutions and turnkey systems for the solar, semiconductor, and microelectronics industry wet processing needs.

For Further information contact:
sales@precisionprocess.com

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