Low Profile Heat Sink Cools ASICs in Tight Packaging Systems

Norwood, MA, April 18, 2010 --(PR.com)-- Advanced Thermal Solutions, Inc. (ATS) is offering industry-unique low profile cooling solution of a variety of ASICs. The ATS-56002 maxiFLOW heat sink features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling without the need for an integral fan. The 56002 heat sink is just 4 mm high; its length and width are both 25 mm. The aluminum sink features a black anodized finish. It comes preassembled with a high performance thermal interface material (TIM) with double-sided adhesive to enhance thermal transfer. The heat sink’s thermal resistance is just 5.2°C/W at 200 ft/min airflow in ducted conditions.

Advanced Thermal Solutions, Inc. (ATS) is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling products, laboratory-quality thermal instrumentation, along with thermal consulting services and training. From its state-of-the-art, US-based rapid prototyping and production facilities to its multiple strategic partners positioned in Europe and Asia, ATS has the capability to meet virtually any metal fabrication requirement with dual sourcing options and ISO certified partners globally. ATS celebrates its 20 years of service to the electronics industry. For information, contact ats-hq@qats.com or visit their website at www.qats.com

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