New Design Service Optimizes PCBs to Manage Excess Heat

Norwood, MA, August 28, 2010 --(PR.com)-- With multiple, fast-running components the total power dissipation of a PCB is often several hundred watts. ATS provides thermal design and characterization of PCBs from their US-based, state-of-the-art thermal analysis labs to determine the optimal placement of components and enhance the cooling effects of natural or forced airflow. ATS thermal engineers use both analytical and computational design methods, along with visualization tests to enhance airflow across a PCB so that all components are effectively cooled. Thermal analyses and verification studies allow designers to minimize the size, number and cost or heat sinks, fan sinks, thermal vias and other mechanical cooling systems.

ATS provides detailed test and design reports, including computational fluid dynamic (CFD) images of components and board areas, and visual demonstrations of improved airflow across the PCB landscape. Thermal data is provided for all components requiring cooling assistance. When necessary, ATS recommends specific heat sinks or other cooling methods to bring a PCB within its required thermal range.

An example of ATS’ services involved a Tier 1 telecommunications equipment OEM. Even with 24 heat sinks on their PCB the OEM was unable to sufficiently reduce the board’s operational temperature. ATS determined optimal placement and heat sink design using analytical design, computational design (DNS) and flow visualization testing. Verification analysis was performed using experimental mockup testing in a wind tunnel. The engineering solution was an optimized design by using flow turbulators and eight high efficiency heat sinks. The solution met the target operating temperature for the customer’s board and reduced the cost of the previous thermal management solution.

For more information about ATS design services for PCB cooling, visit: http://qats.com/Services/PCB-Board-Layout/2.aspx

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