ATS maxiFLOW™ Heat Sinks Provide High Cooling Performance in Low Airflow Conditions

Norwood, MA, December 05, 2010 --(PR.com)-- MaxiFLOW™ heat sinks are manufactured from extruded aluminum which minimizes thermal resistance from the base to the fins, reduces weight, and keeps costs low. Tests on maxiFLOW™ heat sinks using an air flow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. A scientific study on heat sinks conducted at Northeastern University (“Experimental and Theoretical Investigation of Thermal Performance of Heat Sinks”) determined that maxiFLOW™ heat sinks had the lowest thermal resistance per unit area of all of the heat sinks at low air speeds.

Higher performance maxiFLOW™ heat sinks can help ensure reliable product life at a lower cost than custom designed solutions and other extruded sinks. ATS maxiFLOW™ heat sinks, provided with a thermally conductive tape, are available in lengths and widths ranging from 15 x 15 mm to 45 x 45 mm. With thermal tape attachment, the heat sinks meet Telcordia GR-63 Core; ETSI 300 019, and MIL-STD-810 shock and vibration testing standards.

ATS customers have successfully used ATS maxiFLOW™ heat sinks where other heat sinks were insufficient to cool a project. This includes LTE and WiMAX Telecommunications equipment, Optical Transport equipment, and multi-core packet processor based boards.

MaxiFLOW™ heat sinks are also available with the ATS maxiGRIP™ heat sink clip and superGRIP™ heat sink clip.

More information on maxiFLOW™ heat sinks, including individual data sheets, is available from the ATS website at http://www.qats.com, by calling ATS at 781-769-2800 or email us at ats-hq@qats.com. Copies of the Northeastern University study are available upon request by emailing akoss@qats.com

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