Save Thousands of Dollars in Semiconductor Thermal Simulation with ATS’s HFC-100

Norwood, MA, February 18, 2011 --(PR.com)-- Advanced Thermal Solutions, (ATS), HFC-100, The Heat Flux Controller™, is a high heat flux chip simulator capable of measuring and controlling the amount of heat in a resistive element. The HFC-100 comes with a chip simulator capable of dissipating 1k /cm2. The design of the heater block insures minimal heat loss to the ambient, hence a more accurate thermal resistance determination of either heat sinks or cold plates.

Deploying the HFC-100 makes it possible to replace expensive semiconductor samples typically used early in the design process as part of system’s thermal design. By having equipment like the HFC-100 available, engineers can get an early jump on a project’s thermal design. Doing so improves the likelihood of a successful design the first time, reducing a potential project bottleneck if attempted further down a project’s design cycle.

The HFC-100 is capable of transient steady state and transient measurements. It can accommodate up to eight thermocouple sensors for precise temperature measurement. Engineers can dynamically control the power levels and dynamically measure the resistance of the heating element for accurate dissipation calculation. The instrument automatically shuts off if the heater temperature rises above the user defined protocol.

This HFC-100 features ATS proprietary fluxSTAGE™, a LabView™ application, which automates the use of the system and allows the user to choose multiple heat loads at a specific dwell time. The program calculates the thermal resistance of the cold plate for desired cooling of the die and measures the simulated junction’s temperature.

The HFC-100 is available now and more information may be found at:
http://qats.com/Products/Specialty-Instruments/Heat-Flux-Controller/HFC-100/2590.aspx

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