ATS Heat Sinks Cool New Intel Sandy Bridge Processors in ATCA and Other Applications
ATS is now providing heat sink design services to thermally manage 2nd generation Intel Core iProcessors with Sandy Bridge Microarchitecture being used in ATCA, blade servers and single board computers.
Norwood, MA, April 22, 2011 --(PR.com)-- ATS, Advanced Thermal Solutions, Inc., is now providing design engineering services to thermally manage 2nd generation Intel Core iProcessors with Sandy Bridge Microarchitecture. Application specialties include ATCA telecommunications equipment, blade servers and single board computers applications
One application of ATS’s new offering is seen in work they are doing with a Tier 1 telecommunication equipment manufacturer. For this customer ATS is providing a thermal management system, in the form of high-performance copper heat sinks with custom heat sink push-pin attachment, for the Intel Sandybridge processors. The processors with heat sinks are used on multiple ATCA standard boards in a telecommunications equipment cabinet. Up to 14 boards are installed in the narrow form factor chassis.
Intel’s new Sandy Bridge microarchitecture unifies processor cores, memory controller, last-level cache (LLC) and graphics and media processing. The result is a leap in performance and energy efficiency beyond previous generation process technologies.
The telecommunications project involves multiple processors reaching a total heat load of 350 W. While the new Intel processors run cooler than previous generations they still require a thermal management system to keep within established operating temperatures. ATS engineers determined that three different sizes of the company’s unique heat sinks were the right approach to provide the necessary cooling. In addition, ATS analysis pointed to the use of copper as the best heat sink material for this application. Spring-loaded screws fasten the copper heat sinks directly mounted onto the ATCA-compliant boards, and on top of the high performance Intel Core i processors. A phase-change thermal interface material efficiently transfers heat from the Intel processors in the ATS heat sinks. ATS’s work resulted in a board that met the projects requirements both in terms of cost and performance. In addition the design met Telcordia GR-63 Core; ETSI 300 019, and MIL-STD-810 shock and vibration testing standards
More information on ATS’s design engineering can be found at the company’s web site, http://www.qats.com/Services/Design-Services-/4.aspx or by calling ATS at 781-769-2800 or through email ats-hq@qats.com
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One application of ATS’s new offering is seen in work they are doing with a Tier 1 telecommunication equipment manufacturer. For this customer ATS is providing a thermal management system, in the form of high-performance copper heat sinks with custom heat sink push-pin attachment, for the Intel Sandybridge processors. The processors with heat sinks are used on multiple ATCA standard boards in a telecommunications equipment cabinet. Up to 14 boards are installed in the narrow form factor chassis.
Intel’s new Sandy Bridge microarchitecture unifies processor cores, memory controller, last-level cache (LLC) and graphics and media processing. The result is a leap in performance and energy efficiency beyond previous generation process technologies.
The telecommunications project involves multiple processors reaching a total heat load of 350 W. While the new Intel processors run cooler than previous generations they still require a thermal management system to keep within established operating temperatures. ATS engineers determined that three different sizes of the company’s unique heat sinks were the right approach to provide the necessary cooling. In addition, ATS analysis pointed to the use of copper as the best heat sink material for this application. Spring-loaded screws fasten the copper heat sinks directly mounted onto the ATCA-compliant boards, and on top of the high performance Intel Core i processors. A phase-change thermal interface material efficiently transfers heat from the Intel processors in the ATS heat sinks. ATS’s work resulted in a board that met the projects requirements both in terms of cost and performance. In addition the design met Telcordia GR-63 Core; ETSI 300 019, and MIL-STD-810 shock and vibration testing standards
More information on ATS’s design engineering can be found at the company’s web site, http://www.qats.com/Services/Design-Services-/4.aspx or by calling ATS at 781-769-2800 or through email ats-hq@qats.com
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Contact
Advanced Thermal Solutions, Inc.
Andrea Koss
781-769-2800
www.qats.com
Andrea Koss
781-769-2800
www.qats.com
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