ATS maxiFLOW Heat Sink Named to EDN Magazine’s Hot 100 Products of 2011
Advanced Thermal Solution’s Push Pin-Mounted maxiFLOW™ heat sink has been named one of the 2011 Hot 100 Products by EDN Magazine.
Norwood, MA, December 04, 2011 --(PR.com)-- Advanced Thermal Solutions has announced that their maxiFLOW™ push pin-mounted heat sink is one of EDN magazine’s “100 Hot Products of 2011.” EDN’s Hot 100 comprises the electronics industry’s most significant products of the year based on their innovation, significance, usefulness and popularity.
ATS maxiFLOW heat sinks use an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components. The metal heat sinks are cross cut allowing air flow in different directions. This improves their effectiveness in cooling BGAs and other hot components.
These maxiFLOW heat sinks are provided with a pair of durable push pins in a choice of plastic or brass. Plastic pins are lighter and non-electrically conductive; brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 2 lbs (1 kg) of retention load, depending on the height of the component and the PCB thickness.
The patented ATS maxiFLOW sinks feature a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling in the restricted-airflow conditions, common with today’s condensed-size electronic packages. The heat sinks are fabricated from lightweight extruded aluminum which minimizes thermal resistance from the base to the fins. They have a protective green anodized surface.
Tests on maxiFLOW heat sinks with an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using conventional straight-fin heat sinks.
The push pin-mount maxiFLOW heat sinks are available in sizes ranging from 37.4 x 37.5 x 10.0 mm (L x W x H) up to 41.4 x 45.75 x 24.5 mm (L x W x H). Each maxiFLOW heat sink is provided preassembled with a phase-change thermal-interface material (TIM) for improved component-to-sink thermal transfer. The pad is centered on the base of the sink.
“We’re delighted to be chosen as one of EDN’s Hot 100 Products of 2011” said Dr. Kaveh Azar, founder and CEO of ATS. “EDN’s award affirms our mission to provide innovations in thermal management.”
Said Rich Pell, Executive Editor of EDN, “This awards program has been in existence since 1993 and over the years has highlighted many industry trends – this year is no different. We are very pleased to showcase the top products of the many thousands announced during the past year that especially caught the attention of our editors and readers.”
The complete list of EDN’s Hot 100 Products can be found at http://www.edn.com/article/519946-EDN_Hot_100_products_of_2011.php?cid=hot100 or in the December 15, 2011 issue of EDN Magazine.
About ATS (www.qats.com)
Advanced Thermal Solutions, Inc (ATS) is a leading engineering/manufacturing company focused on innovations in the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renowned for its product and service portfolio including more than 450 high- and ultra performance heat sinks, research-quality test equipment, leading-edge R&D, thermal engineering consulting and thermal management education.
About EDN (www.edn.com)
EDN, a leading UBM Electronics brand, is the comprehensive information resource for the electronics original equipment manufacturer segment, providing in-depth technical information for electronics design engineers and news and strategic business insight for executives.
About UBM Electronics
UBM Electronics is the global leader in media and marketing solutions for the electronics industry. UBM Electronics delivers results for the key influencers and decision makers involved in the design, development and commercialization of technology through its market leading brands, peer communities and professional education services. More than 2.2 million engineering professionals engage with UBM Electronics brands which include EE Times, EDN, EDN China, EDN Asia, EDN Japan, Design News and Test & Measurement World, TechOnline, Designlines and Embedded.com across the globe to accelerate technology sales. The international electronics community gathers at UBM Electronics market leading events such as the Embedded Systems Conferences, DesignCon and ARM Technology Conference to share, learn, discuss, and advance the critical issues and challenges facing the electronics industry. Additionally, UBM Electronics provides end-to-end services ranging from next-generation marketing, integrated media, custom solutions and research. UBM Electronics is part of UBM (UBM.L) a global provider of media and information services for professional B2B communities and markets.
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ATS maxiFLOW heat sinks use an integral push pin mounting system for fast, safe attachment of the heat sinks onto BGAs and other hot components. The metal heat sinks are cross cut allowing air flow in different directions. This improves their effectiveness in cooling BGAs and other hot components.
These maxiFLOW heat sinks are provided with a pair of durable push pins in a choice of plastic or brass. Plastic pins are lighter and non-electrically conductive; brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 2 lbs (1 kg) of retention load, depending on the height of the component and the PCB thickness.
The patented ATS maxiFLOW sinks feature a low-profile, spread-fin array that maximizes surface area for more effective convection (air) cooling in the restricted-airflow conditions, common with today’s condensed-size electronic packages. The heat sinks are fabricated from lightweight extruded aluminum which minimizes thermal resistance from the base to the fins. They have a protective green anodized surface.
Tests on maxiFLOW heat sinks with an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using conventional straight-fin heat sinks.
The push pin-mount maxiFLOW heat sinks are available in sizes ranging from 37.4 x 37.5 x 10.0 mm (L x W x H) up to 41.4 x 45.75 x 24.5 mm (L x W x H). Each maxiFLOW heat sink is provided preassembled with a phase-change thermal-interface material (TIM) for improved component-to-sink thermal transfer. The pad is centered on the base of the sink.
“We’re delighted to be chosen as one of EDN’s Hot 100 Products of 2011” said Dr. Kaveh Azar, founder and CEO of ATS. “EDN’s award affirms our mission to provide innovations in thermal management.”
Said Rich Pell, Executive Editor of EDN, “This awards program has been in existence since 1993 and over the years has highlighted many industry trends – this year is no different. We are very pleased to showcase the top products of the many thousands announced during the past year that especially caught the attention of our editors and readers.”
The complete list of EDN’s Hot 100 Products can be found at http://www.edn.com/article/519946-EDN_Hot_100_products_of_2011.php?cid=hot100 or in the December 15, 2011 issue of EDN Magazine.
About ATS (www.qats.com)
Advanced Thermal Solutions, Inc (ATS) is a leading engineering/manufacturing company focused on innovations in the thermal management of electronics. Founded in 1989 as a consulting company, ATS has evolved to a complete thermal solutions provider and is world renowned for its product and service portfolio including more than 450 high- and ultra performance heat sinks, research-quality test equipment, leading-edge R&D, thermal engineering consulting and thermal management education.
About EDN (www.edn.com)
EDN, a leading UBM Electronics brand, is the comprehensive information resource for the electronics original equipment manufacturer segment, providing in-depth technical information for electronics design engineers and news and strategic business insight for executives.
About UBM Electronics
UBM Electronics is the global leader in media and marketing solutions for the electronics industry. UBM Electronics delivers results for the key influencers and decision makers involved in the design, development and commercialization of technology through its market leading brands, peer communities and professional education services. More than 2.2 million engineering professionals engage with UBM Electronics brands which include EE Times, EDN, EDN China, EDN Asia, EDN Japan, Design News and Test & Measurement World, TechOnline, Designlines and Embedded.com across the globe to accelerate technology sales. The international electronics community gathers at UBM Electronics market leading events such as the Embedded Systems Conferences, DesignCon and ARM Technology Conference to share, learn, discuss, and advance the critical issues and challenges facing the electronics industry. Additionally, UBM Electronics provides end-to-end services ranging from next-generation marketing, integrated media, custom solutions and research. UBM Electronics is part of UBM (UBM.L) a global provider of media and information services for professional B2B communities and markets.
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Contact
Advanced Thermal Solutions, Inc.
Andrea Koss
781-769-2800
www.qats.com
Andrea Koss
781-769-2800
www.qats.com
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