New Arrival: Fanless Embedded System BIS-6660 with Next Gen NORCO's Proprietary “ICEFIN” Thermal Design
Shenzhen, China, November 29, 2012 --(PR.com)-- BIS-6660, a fanless embedded Box PC with the new generation of NORCO's proprietary ICEFIN™ Thermal design, ensures maximum heat dissipation and a true fanless system, utilizing Intel's latest Atom cedar trail N2800/D2550 embedded CPUs. System provides redundant network connectivity with Wifi and 3G support. One internal SIM slot offers system rich expansions. The DVI+VGA dual independent display output also makes it a great choice as digital signage systems. Whatever the application, be it automation, digital signage, information control, point of sale, transportation or even electronic police, this fanlesss Intel Cedar Trail based dual display system is designed to be high performance, reliable, secure and easy to manage.
Ultra-Low Power Design
This embedded system utilizes Intel next generation Atom cedar trail D2800/N2550 processors. which are built on 32nm process technology with 2x 512KB L2 Cache and DDR3 system memory with up to 4GB support. The Intel® Graphics Media Accelerator 3650 and the memory controller are integrated on the same chip, enabling more space-efficient solutions. The Thermal Design Power (TDP) of the dual-core Intel Atom processor N2800 is only 6.5W, enabling further power reductions, smaller systems and performance improvements, and providing customers a high performance embedded design platform that requires low power operation.
Rich Expansions, Redundant Connectivity
System with low power consumption can support rich I/O and comes with a high connectivity and expansion options. Six USB2.0 Ports, two serial ports, two audio jacks, 1x VGA and 1x DVI port support dual independent display, and two Mini PCI Express expansion slots with one supporting 3G/WiFi (optional), enabling easy integration. One Gigabit Ethernet ports are also available for high speed networking and one SIM card slot for 3G module. All this connectivity is packed into a space-saving, power-efficient, and cost-effective fanless embedded box PC, providing richer peripheral expansion options.
Key Features:
-Intel NM10 chipset, onboard Intel Atom N2800/D2550 processors
-The next generation ICEFIN fanless architecture, easy to install and maintain
-1x SO-DIMM supports DDR3 1066MHz RAM upto 4GB
-Support WiFi & 3G redundant connectivity, one internal SIM card slot (optional)
-Support DVI/VGA dual independent display
-Rich I/O: 6x USB2.0/1x VGA /1x DVI /2x COM /1x LAN/1x Audio
NORCO new generation proprietary "ICEFIN" embedded system BIS-6660 is available now. For more products information, please visit www.norco-group.com or contact global@norco.com.cn.
Ultra-Low Power Design
This embedded system utilizes Intel next generation Atom cedar trail D2800/N2550 processors. which are built on 32nm process technology with 2x 512KB L2 Cache and DDR3 system memory with up to 4GB support. The Intel® Graphics Media Accelerator 3650 and the memory controller are integrated on the same chip, enabling more space-efficient solutions. The Thermal Design Power (TDP) of the dual-core Intel Atom processor N2800 is only 6.5W, enabling further power reductions, smaller systems and performance improvements, and providing customers a high performance embedded design platform that requires low power operation.
Rich Expansions, Redundant Connectivity
System with low power consumption can support rich I/O and comes with a high connectivity and expansion options. Six USB2.0 Ports, two serial ports, two audio jacks, 1x VGA and 1x DVI port support dual independent display, and two Mini PCI Express expansion slots with one supporting 3G/WiFi (optional), enabling easy integration. One Gigabit Ethernet ports are also available for high speed networking and one SIM card slot for 3G module. All this connectivity is packed into a space-saving, power-efficient, and cost-effective fanless embedded box PC, providing richer peripheral expansion options.
Key Features:
-Intel NM10 chipset, onboard Intel Atom N2800/D2550 processors
-The next generation ICEFIN fanless architecture, easy to install and maintain
-1x SO-DIMM supports DDR3 1066MHz RAM upto 4GB
-Support WiFi & 3G redundant connectivity, one internal SIM card slot (optional)
-Support DVI/VGA dual independent display
-Rich I/O: 6x USB2.0/1x VGA /1x DVI /2x COM /1x LAN/1x Audio
NORCO new generation proprietary "ICEFIN" embedded system BIS-6660 is available now. For more products information, please visit www.norco-group.com or contact global@norco.com.cn.
Contact
Shenzhen NORCO Intelligent Technology Co,. Ltd
Ashley Chen
0755-27330249
www.norco-group.com
Contact
Ashley Chen
0755-27330249
www.norco-group.com
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