New Arrival: Full Featured Fanless System BIS-6590 Utilizing Next Gen NORCO’s Proprietary Large “ICEFIN” Thermal Design

Shenzhen, China, November 29, 2012 --(PR.com)-- Recently, NORCO announced the launch of the embedded system BIS-6590 utilizing its next generation proprietary "ICEFIN" thermal design, ensures maximum heat dissipation and a true fanless system. This fanless embedded system is integrated into a 280mm× 219.2mm×115 mm chassis. The embedded motherboard BPC-7937 is based on Intel H61/Q77/B75 chipsets, supporting Intel Sandy Bridge/Ivy Bridge Core i3/i5 and Celeron processors. System provides redundant network connectivity with 3G support. One Mini PCIe, 2x PCI (optional 1x PCI & 1x PCIE X4) and one internal SIM slot offer system rich expansions. The DVI+VGA dual independent display output also makes it a great choice as digital signage systems. Whatever the application, be it automation, digital signage, information control, point of sale, transportation or even electronic police, this fanlesss dual display system is designed to be high performance, reliable, secure and easy to manage.

Fanless Design, Better Heat Dissipation

Next Gen NORCO's proprietary large "ICEFIN" fanless structure, coming with the aluminium+ fine quality galvanized steel sheet chassis, makes this new "ICEFIN" fanless system to offer better heat dissipation performance, compared with the old generation "ICEFIN" thermal system. It is a true fanless solution.

Rich Expansions, Dual Display, Redundant Connectivity

System supports rich I/O and comes with a high connectivity and expansion options. Six USB Ports, two serial ports, 1x VGA and 1x DVI port support dual independent display, and one Mini PCIe expansion slot supports one Mini PCIe SSD. one SIM card slot for 3G module, 2x PCI ( optional 1x PCI & 1x PCIE X4) can be extended by expansion slot,enabling easy integration. Two Gigabit Ethernet ports are also available for high speed networking. All this connectivity is packed into a space-saving, power-efficient fanless embedded box PC, providing richer peripheral expansion options.

Performance Improvement, Low Cost Solution

This fanless embedded system is powered by Intel 2nd and 3rd GEN Sandy Bridge/Ivy Bridge Core i5/i3 as well as the Celeron CPUs and Intel H61/Q77/B75 based. System with the new Core platforms features Intel® Turbo Boost Technology and Intel® Rapid Storage Technology, bringing up to 15% improvement in performance while offering new levels of protection for data sensitive applications. Also, optimized with Intel® vPro technology, the dual Gigabit Ethernet ports support Wake-on-LAN capabilities reducing costs by both allowing remote monitoring and management, offering customers cost-effective solutions.

Product Highlights:

-Intel H61/Q77/B75 Chispets, onboard Intel Sandy Bridge/Ivy Bridge Core i3/i5/Celeron CPUs

-2x DDR3 DIMM slots support dual channel DDR3 1066/1333/1600 MHz RAM upto 16GB. Non-ECC

-1x VGA , 1x DVI video out, DVI+VGA dual independent display support

-Dual Gigabit LAN ports, Wake-on-LAN support

-1x SATAII/SATAIII, 2x COM, 1x Mini PCIe, PS/2, 1x PCIe X4, 2x PCI, 6x USB , 8bit GPIO

-NORCO's proprietary large "CEFIN" thermal design, fanless solution

This new generation NORCO's proprietary large "ICEFIN" fanless system is available now. Look for more product information, please visit www.norco-group.com or contact global@norco.com.cn.