SparkLAN Highly Customized WiFi 11n Low Power Consumption SDIO Module with Atheros AR6003 Solution
SparkLAN WSDA-157GN 802.11b/g/n SDIO module, embedded with Qualcomm Atheros AR6003 chipset, is designed to offer low power consumption solution for low power operated portable or handheld devices.
Taipei, Taiwan, December 29, 2012 --(PR.com)-- SparkLAN Communications, Inc., a broadband wireless networking solution provider introduces a wireless 802.11n 1-stream SDIO module with Qualcomm Atheros AR6003 chipset that is designed to offer ultra low power consumption solution for low power/ battery operated or portable devices.
SparkLAN WSDA-157GN, embedded with Qualcomm Atheros AR6003 chipset, is a mini-sized wireless SDIO module (3x2cm). Its small footprint makes it easy to embed into new or existing designs that have limited space for WiFi connection integration on board. The SDIO module adopts advanced 802.11b/g/n technology, which runs up to 72.2Mbps data rates and delivers up to 16dBm output.
With Atheros EPA (Efficient Power Amplifier) technology, WSDA-157GN reduces overall power consumption to achieve the latest trend of Green technology, which makes WSDA-157GN the ideal solution for low power / battery operated devices like portable medical devices, industrial tablet devices, handheld scanners, mobile printers that require minimum power usage.
WSDA-157GN SDIO module has a variety of connector mounts, such as pin header, wafer, and half hole (castellation on the edge), which allows embedded system manufacturers to easily add Wi-Fi function to their devices with greater design flexibility and helps to accelerate time-to-market.
Added feature also includes antenna diversity, customers can choose between printed or U.FL antenna based on their unique requirement. The AR6003 chipset features Atheros Universal Wireless Cooperation technology, which is a suite of WiFi coexistence techniques to enhance simultaneous operation of WLAN and Bluetooth on the same device.
SparkLAN is the pioneer in industry to provide small-sized highly customized SDIO module to satisfy diversified needs of customers. Samples will be available for evaluation soon.
WSDA-157GN Features
*Host Interface: SDIO 2.0 with 3 alternate types of connectors (pin header, wafer connector, or half hole/ castellation on the edge)
*Antenna: 1 x U.FL or 1 x Printed antenna, 1T1R
*Small dimension: 30 x 20mm
*Output power up to 16dBm
*Enhanced wireless security: WEP, WPA, WPA2
*Support Windows 7, Linux, Android by request
SparkLAN WSDA-157GN, embedded with Qualcomm Atheros AR6003 chipset, is a mini-sized wireless SDIO module (3x2cm). Its small footprint makes it easy to embed into new or existing designs that have limited space for WiFi connection integration on board. The SDIO module adopts advanced 802.11b/g/n technology, which runs up to 72.2Mbps data rates and delivers up to 16dBm output.
With Atheros EPA (Efficient Power Amplifier) technology, WSDA-157GN reduces overall power consumption to achieve the latest trend of Green technology, which makes WSDA-157GN the ideal solution for low power / battery operated devices like portable medical devices, industrial tablet devices, handheld scanners, mobile printers that require minimum power usage.
WSDA-157GN SDIO module has a variety of connector mounts, such as pin header, wafer, and half hole (castellation on the edge), which allows embedded system manufacturers to easily add Wi-Fi function to their devices with greater design flexibility and helps to accelerate time-to-market.
Added feature also includes antenna diversity, customers can choose between printed or U.FL antenna based on their unique requirement. The AR6003 chipset features Atheros Universal Wireless Cooperation technology, which is a suite of WiFi coexistence techniques to enhance simultaneous operation of WLAN and Bluetooth on the same device.
SparkLAN is the pioneer in industry to provide small-sized highly customized SDIO module to satisfy diversified needs of customers. Samples will be available for evaluation soon.
WSDA-157GN Features
*Host Interface: SDIO 2.0 with 3 alternate types of connectors (pin header, wafer connector, or half hole/ castellation on the edge)
*Antenna: 1 x U.FL or 1 x Printed antenna, 1T1R
*Small dimension: 30 x 20mm
*Output power up to 16dBm
*Enhanced wireless security: WEP, WPA, WPA2
*Support Windows 7, Linux, Android by request
Contact
SparkLAN Communications, Inc
Yi-Ching Shih
886-2-2659-1880
www.sparklan.com
Yi-Ching Shih
886-2-2659-1880
www.sparklan.com
Contact
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