Free Technical Thermal Engineering Webinar on July 18 by Advanced Thermal Solutions
Advanced Thermal Solutions, Inc. presents a free technical webinar, Using Thermal Interface Materials to Improve Heat Sink Thermal Performance, for all interested engineers. The hour-long event begins at 2:00 pm ET on Thursday, July 18.
Norwood, MA, July 12, 2013 --(PR.com)-- Advanced Thermal Solutions, Inc. (ATS) will present Using Thermal Interface Materials to Improve Heat Sink Thermal Performance, a free technical webinar for engineers working in the thermal management of electronic components. The hour-long webinar starts at 2:00 ET on Thursday, July 18.
As chips get hotter, thermal interface materials, or TIMs, play a pivotal role in transporting their heat into heat sinks. Properly chosen and applied TIMs can replace the air gaps that impede thermal transfer. They offer minimal thermal resistance between a hot component surface and its contacting heat sink.
TIMs are available in many forms, from pads to PCMs, and from greases to graphene-filled composites. Application methods are nearly as varied.
In many cases, cooling performance can be improved by using a higher performance interface material. This can avoid the costly need for larger fans and heat sinks, or increasing surface areas to spread component heat.
In this webinar, attendees will learn the importance of lowering thermal resistance using thermal interface materials. They will gain insight into the different kinds of TIMs available from the market, and how and where they are now being used.
Presenting the ATS webinar Using Thermal Interface Materials to Improve Heat Sink Thermal Performance webinar is Dr. Kaveh Azar, President, CEO and founder of Advanced Thermal Solutions. Dr. Azar is an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA.
To attend the July 18 webinar, engineers can sign up directly at https://www2.gotomeeting.com/register/901527394 or on the ATS website: http://www.qats.com (Training section). There is no fee to attend, but virtual seating is limited.
More information is available by emailing ats-hq@qats.com, or by calling 781-769-2800.
As chips get hotter, thermal interface materials, or TIMs, play a pivotal role in transporting their heat into heat sinks. Properly chosen and applied TIMs can replace the air gaps that impede thermal transfer. They offer minimal thermal resistance between a hot component surface and its contacting heat sink.
TIMs are available in many forms, from pads to PCMs, and from greases to graphene-filled composites. Application methods are nearly as varied.
In many cases, cooling performance can be improved by using a higher performance interface material. This can avoid the costly need for larger fans and heat sinks, or increasing surface areas to spread component heat.
In this webinar, attendees will learn the importance of lowering thermal resistance using thermal interface materials. They will gain insight into the different kinds of TIMs available from the market, and how and where they are now being used.
Presenting the ATS webinar Using Thermal Interface Materials to Improve Heat Sink Thermal Performance webinar is Dr. Kaveh Azar, President, CEO and founder of Advanced Thermal Solutions. Dr. Azar is an active participant in the electronics thermal community and has served as the organizer, general chair and the keynote speaker at national and international conferences sponsored by ASME, IEEE and AIAA.
To attend the July 18 webinar, engineers can sign up directly at https://www2.gotomeeting.com/register/901527394 or on the ATS website: http://www.qats.com (Training section). There is no fee to attend, but virtual seating is limited.
More information is available by emailing ats-hq@qats.com, or by calling 781-769-2800.
Contact
Advanced Thermal Solutions, Inc.
Andrea Koss
781-769-2800
www.qats.com
Andrea Koss
781-769-2800
www.qats.com
Contact
Categories