3D Laser Deep-Engraving Material Processing System Contract Awarded to Fonon by Custom Firearms Manufacturer

Lake Mary, FL, March 16, 2011 --(PR.com)-- Fonon Technologies, a laser-based systems provider for both 3D Subtractive Materials Processing Systems and 3D Additive Materials Manufacturing Systems awarded contract by Custom Firearms Manufacturer.

Fonon Technologies’ LaserTower™ MegaCenter is the largest, industrial-grade high-volume deep-engraving system in the industry supporting a working area of 42” by 42”.

Fonon Technologies is pleased to announce that a custom firearms manufacturer has purchased their second 3D LaserTower™ MegaCenter to support deep-engraving applications. The company purchased their first MegaCenter over 7 years ago. Under continuous high-usage, we are pleased to report they have experience no services issues to date. As their business continues to expand, they have purchased a second high-volume, deep-engraving system to keep pace with demand.

Fonon Technologies’ Family of LaserTower™ Marking & Engraving Systems is a new generation of 3D Laser Subtractive Materials Processing Systems for Direct Parts Marking, UID/UDI Barcoding and Deep Engraving applications. They are the most advanced, compact, industrial-grade laser marking and engraving systems available in the market.

Fonon Technologies has the largest array of laser based systems in the 3D Subtractive and 3D Additive Materials Processing Industry. The company’s area of expertise is tooling application specific laser-based material processing systems based on the unique requirements of industry specific sectors including medical, automotive, aviation, aerospace, military, marine and industrial.

Fonon Technologies is the recognized leader of industrial grade 3D Additive and 3D Subtractive laser-based material processing systems. We offer cutting-edge Additive Manufacturing Solutions for 3D Metal Printing Systems based on Direct Metal Laser Sintering (DMLS) and Subtractive Manufacturing Solutions for 3D Marking, Engraving and Cutting Systems including our patented OWCT™ Zero Width laser Cutting Technology for glass, silicon and other brittle materials. Our systems are used world-wide in the semiconductor, flat panel display, automotive, aerospace, industrial, defense, electronic and medical industries with a portfolio of intellectual property, knowhow & inventions placing our company in the unique position to offer both standard 3D material processing systems or our specialty of tooling 3D laser-based transforming systems designed around the unique applications of our customers.

Notice Regarding Forward-Looking Statements:
Statements regarding financial matters in this press release other than historical facts are “forward-looking statements” (“FLS”) within the meaning of section 27A of the Securities Act of 1933, Section 21E of the Securities Exchange Act of 1934, and as that term is defined in the Private Securities Litigation Reform Act of 1995. FLS include statements predictive in nature, depending upon or referring to future events / conditions, including words like “believes,” “anticipates,” “intends,” “plans,” “expects,” and similar expressions. Statements concerning future financial performance (revenues, earnings, and growth rates), ongoing business strategies / prospects, and future actions, which may be provided by management, are also FLS as defined by the Act. The actual and any future results, performance or achievements of the Company, expressed or implied, may be materially different and vary significantly for different reporting periods due to FLS that involve known and unknown risks and other factors. Management believes that the assumptions made and expectations reflected in the FLS are reasonable. There is no assurance that the underlying assumptions will prove to be correct and the actual future results may be different from expectations expressed above. These statements are not guarantees of future performance. Fonon Technologies has no specific intention to update these statements.