Lanner Further Expands Carrier-Grade Network Appliances HCP-72i2 for Telecom Applications
The HCP-72i2 is a 2U rackmount telecom network appliance built with Lanner's unique Hybrid Telecommunications Computing Architecture (HybridTCA™), which is created to meet the challenging requirements for carrier-grade network control, cloud computing and data center.
New Taipei City, Taiwan, April 27, 2016 --(PR.com)-- The rapid adoption of cloud-based concepts into the telecom domain has triggered the shift from traditionally hardware-oriented business model into a software-centered proposition. In fact, telecom industries are requiring carrier-grade hardware architectures with high-performance, high-availability and high-scalability for deployments under NFV (Network Functions Virtualizations) and SDN (Software Defined Networking). Responding to this increasing demand, Lanner further expands its carrier-grade network appliances by introducing HCP-72i2 as its next telecom-standard, high-volume network platform.
HCP-72i2 is built with a full modular-design, by offering two rear-accessible Intel x86 CPU blades and three front-swappable network blades in a 2U rackmount server. In fact, the three networking I/O blades are hot-swappable through LCM control. This allows high-scalability in telecom applications as the modular blades perform offload duties.
The CPU blades are empowered by Intel® Xeon® processor E5-2690 v3 series CPU and C612 chipset (Haswell-EP) for extreme high-performance and data processing capability. Meanwhile, regarding data memory, HCP-72i2 supports qual-channel DDR4 at 2,133 MHz registered socket with maximum capacity up to 512GB (16 x DIMM sockets for each blade). This hardware blade design ensures ultra low latency and extreme processing power to maximize virtualization related performance.
In terms of networking I/O density, HCP-72i2 delivers up to 36 x GbE SFP or 24 x 10GbE SFP+, while keeping one management port and one IPMI port.
For deployments in telecom industries, HCP-72i2 is compliant with NEBS and FIPS standards. Regarding high-availability in 24/7 operations, HCP-72i2 is designed with redundant power supply.
HCP-72i2
High Availability Rackmount 2U Telecom Network Appliance with 2 x86 CPU Blades and 3 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear. Support up to 4 Intel® Xeon® E5-2690 v3 CPUs and 32x DDR4 R-DIMM
- Dual mainboard communication through NTB port
- 3 swappable I/O blades on the front. Support up to 36 x 1GbE or 24 x 10GbE network ports in an array
- 2 x swappable 2.5" HDD bay
- NEBS compliance
- Redundant power supply and removable fan module
- IPMI port for remote management
- Hinge LCD module for easy diagnostics and configuration
HCP-72i2 is built with a full modular-design, by offering two rear-accessible Intel x86 CPU blades and three front-swappable network blades in a 2U rackmount server. In fact, the three networking I/O blades are hot-swappable through LCM control. This allows high-scalability in telecom applications as the modular blades perform offload duties.
The CPU blades are empowered by Intel® Xeon® processor E5-2690 v3 series CPU and C612 chipset (Haswell-EP) for extreme high-performance and data processing capability. Meanwhile, regarding data memory, HCP-72i2 supports qual-channel DDR4 at 2,133 MHz registered socket with maximum capacity up to 512GB (16 x DIMM sockets for each blade). This hardware blade design ensures ultra low latency and extreme processing power to maximize virtualization related performance.
In terms of networking I/O density, HCP-72i2 delivers up to 36 x GbE SFP or 24 x 10GbE SFP+, while keeping one management port and one IPMI port.
For deployments in telecom industries, HCP-72i2 is compliant with NEBS and FIPS standards. Regarding high-availability in 24/7 operations, HCP-72i2 is designed with redundant power supply.
HCP-72i2
High Availability Rackmount 2U Telecom Network Appliance with 2 x86 CPU Blades and 3 I/O Blades
- High availability, full redundancy and extreme high performance
- 2 CPU blades in the rear. Support up to 4 Intel® Xeon® E5-2690 v3 CPUs and 32x DDR4 R-DIMM
- Dual mainboard communication through NTB port
- 3 swappable I/O blades on the front. Support up to 36 x 1GbE or 24 x 10GbE network ports in an array
- 2 x swappable 2.5" HDD bay
- NEBS compliance
- Redundant power supply and removable fan module
- IPMI port for remote management
- Hinge LCD module for easy diagnostics and configuration
Contact
Lanner Electronics Inc.
Tiana Wang
886286926060
www.lannerinc.com
Tiana Wang
886286926060
www.lannerinc.com
Contact
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