IPDiA Launches a Range of 100 µm Thick Silicon Capacitors with Superior ESD performance dedicated to Smart Cards & RFID Solutions
IPDiA, world leader in 3D silicon passive components, has developed a new range of Low Profile capacitors with Enhanced ESD performance (up to 8 kV) dedicated to industries such as Smart Card, RFID tags and others where integration as well as excellent antenna matching play key roles. This new LPSC range targets antenna matching, RF filtering and decoupling of active dies, in applications with height and volume constraints. - December 19, 2015
Modelithics Welcomes IPDiA as a New MVP and Announces the Availability of Broadband S-Parameter Data Models for IPDiA Ultra Broadband Silicon Capacitors
Modelithics, Inc. is pleased to welcome IPDiA to the Modelithics Vendor Partner (MVP) Program, and announce the development of three new S-Parameter (SPAR) models for IPDiA ultra-broadband surface mount silicon capacitors. With a capacitance stability over temperature and voltage lower than... - August 28, 2015
IPDiA Launches High Performing 1nF Wire Bondable Vertical Silicon Capacitor in the Smallest Package (0101) for Wireless Communication, Radar and Data Broadcasting Systems
As the market is continually moving towards higher power efficiency and higher working frequency, IPDiA, leader in high density silicon capacitors, announces the launch of its WBSC range dedicated to RF and microwave power applications up to 10 GHz(*) (DC decoupling/DC noise and harmonic filtering/matching networks functions). - April 02, 2015
IPDiA Expands Its High Temperature (250°C) Silicon Capacitor Lines, Dedicated to MCM Assembly Modules, with New Voltage Ranges from 11 V to 450 V
IPDiA, world leader in 3D silicon passive components, is launching the ETSC (200°C) and EXSC (250°C) silicon capacitor ranges to expand its product offering to higher voltage MCM applications. - February 28, 2015
IPDiA Launches the First 100nF/0402 Silicon Capacitor for Ultra Broadband Systems
The UBSC capacitor series from IPDiA provide superior ultra-broadband performance and reliability, making them ideal for the requirements of the most stringent ultra-broadband applications (optoelectronics/high-speed data, trans-impedance amplifiers (TIA), receive-and-transmit optical sub-assembly (ROSA/TOSA), synchronous optical networking (SONET), as well as broadband test equipment and broadband microwave/millimeter-wave). - September 20, 2014
IPDiA Launches 200 °C Automotive Grade Silicon Capacitors in Ultra-Miniaturized Case Sizes
IPDiA, world leader in 3D silicon passive components, has developed a new range of capacitors called ATSC dedicated to ‘under the hood’ applications. The ATSC range meets the demand of automotive sensor manufacturers who are looking for long life components with performance preserved when exposed to harsh conditions. - June 01, 2014
The R&D Program PRIIM Launched by IPDiA Reaches Its End and Allows the Industrialization of Ultra-Miniaturized Electronic Components
Four years after the launch of its PRIIM project (platform for the realization of shared industrial innovation), IPDiA presents the major technological results achieved during this program. - March 23, 2014
IPDiA Ultra Thin and Low ESR/ESL Silicon Capacitors for Decoupling Applications
In order to anticipate the demand for more miniaturization and signal integrity over a wide range of frequencies in the decoupling applications, IPDiA adds to its silicon passive component library some ultra low ESR/ESL structures, in low profile form factor. These new silicon capacitors enable to... - December 12, 2013
IPDiA Launches a Major R&D Program Representing a 37 Million Euros Investment for Medical and Lighting Applications
R&D program will target high density, high voltage integrated 3D capacitor on nanostructure. - June 28, 2013
IPDiA Extends Its Scope and Offers Semiconductor Process Optimization and Transfer Applied to Medical and Hi-Rel Applications
After obtaining ISO 13485 certification in 2012 for medical devices, and in order to respond to the growing demand of customers in the medical and Hi-Rel applications, IPDiA unveils its ability to offer advanced foundry services. - June 02, 2013
Latest News Reports on the IPDiA-Leti Common Lab Results
Leti and IPDiA are proud to unveil a new worldwide record in capacitance density. - April 28, 2012
IPDiA and TecStar/Macnica Announce Distribution Agreement for Japan
After Americas and Europe, IPDiA strengthens its sales network in Asia with one of the leaders in electronic components. - December 11, 2011
IPDiA’s Technology Awarded with the "Grand Prix Siemens de l’Innovation"
For its 10th birthday, the "Grand Prix Siemens de l’Innovation" has been awarded to IPDiA. This event is the opportunity to reward the technological progress and the investments in Research & Development made by the most innovative French companies. The previous years, Saint Gobain, Novartis or PSA Peugeot Citroën have reached the podium. - September 15, 2011